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CORR
2008
Springer
148views Education» more  CORR 2008»
15 years 4 months ago
Copper Electrodeposition for 3D Integration
Abstract-Two dimensional (2D) integration has been the traditional approach for IC integration. Increasing demands for providing electronic devices with superior performance and fu...
Rozalia Beica, Charles Sharbono, Tom Ritzdorf
BMCBI
2006
145views more  BMCBI 2006»
15 years 4 months ago
Querying the public databases for sequences using complex keywords contained in the feature lines
Background: High throughput technologies often require the retrieval of large data sets of sequences. Retrieval of EMBL or GenBank entries using keywords is easy using tools such ...
Olivier Croce, Michaël Lamarre, Richard Chris...
146
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BMCBI
2006
249views more  BMCBI 2006»
15 years 4 months ago
Gene functional similarity search tool (GFSST)
Background: With the completion of the genome sequences of human, mouse, and other species and the advent of high throughput functional genomic research technologies such as biomi...
Peisen Zhang, Jinghui Zhang, Huitao Sheng, James J...
150
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ISCA
2006
IEEE
145views Hardware» more  ISCA 2006»
15 years 4 months ago
Techniques for Multicore Thermal Management: Classification and New Exploration
Power density continues to increase exponentially with each new technology generation, posing a major challenge for thermal management in modern processors. Much past work has exa...
James Donald, Margaret Martonosi
TSMC
2008
137views more  TSMC 2008»
15 years 4 months ago
A Type-2 Self-Organizing Neural Fuzzy System and Its FPGA Implementation
This paper proposes a type-2 self-organizing neural fuzzy system (T2SONFS) and its hardware implementation. The antecedent parts in each T2SONFS fuzzy rule are interval type-2 fuzz...
Chia-Feng Juang, Yu-Wei Tsao