521 search results - page 94 / 105 » Designing technology to aid cognition |
ISPD
2010
ACM
15 years 4 months ago
2010
ACM
In the nanometer IC design, dummy fill is often performed to improve layout pattern uniformity and the post-CMP quality. However, filling dummies might greatly increase intercon...
CODES
2007
IEEE
15 years 4 months ago
2007
IEEE
Memory requirements of intellectual property components (IP) in contemporary multi-processor systems-on-chip are increasing. Large high-speed external memories, such as DDR2 SDRAM...
103
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ISLPED
2010
ACM
14 years 10 months ago
2010
ACM
This paper proposes a framework for (signal) interconnect power optimization at the global routing stage. In a typical design flow, the primary objective of global routing is mini...
ICCAD
2009
IEEE
14 years 7 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
78
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CHI
2009
ACM
15 years 10 months ago
2009
ACM
As user-created content increasingly becomes an ever more prominent element of modern game design, tools have been developed to aide in the creative process for several forms of d...