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» Distributed Agreement with Optimal Communication Complexity
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NANONET
2009
Springer
199views Chemistry» more  NANONET 2009»
15 years 2 months ago
Through Silicon Via-Based Grid for Thermal Control in 3D Chips
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
José L. Ayala, Arvind Sridhar, Vinod Pangra...
MM
2010
ACM
251views Multimedia» more  MM 2010»
14 years 9 months ago
A cognitive approach for effective coding and transmission of 3D video
Reliable delivery of 3D video contents to a wide set of users is expected to be the next big revolution in multimedia applications provided that it is possible to grant a certain ...
Simone Milani, Giancarlo Calvagno
SENSYS
2006
ACM
15 years 3 months ago
Interest dissemination with directional antennas for wireless sensor networks with mobile sinks
Introducing mobile data sinks into wireless sensor networks (WSNs) improves the energy efficiency and the network lifetime, and is demanded for many application scenarios, such a...
Yihong Wu, Lin Zhang, Yiqun Wu, Zhisheng Niu
PODC
2009
ACM
15 years 10 months ago
Tight bounds for clock synchronization
d Abstract] Christoph Lenzen Computer Engineering and Networks Laboratory (TIK) ETH Zurich, 8092 Zurich, Switzerland lenzen@tik.ee.ethz.ch Thomas Locher Computer Engineering and N...
Christoph Lenzen, Thomas Locher, Roger Wattenhofer
GLOBECOM
2007
IEEE
15 years 3 months ago
Beamforming with Limited Feedback in Amplify-and-Forward Cooperative Networks
— A relay selection approach has previously been shown to outperform repetition-based scheduling for both amplify-and-forward (AF) and decode-and-forward (DF) cooperative network...
Yi Zhao, Raviraj Adve, Teng Joon Lim