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ICPP
2008
IEEE
15 years 4 months ago
2008
IEEE
A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, high-speed interface to increase the device density and ...
IPPS
2002
IEEE
15 years 3 months ago
2002
IEEE
Multiple memory module architecture enjoys higher memory access bandwidth and thus higher performance. Two key problems in gaining high performance in this kind of architecture ar...
IPPS
2000
IEEE
15 years 2 months ago
2000
IEEE
In this paper we present sorting algorithms on the recently introduced N2 processor OTIS-Mesh, a network with diameter 4 p N , 3 consisting of N connected meshes of size p N p N...
IPPS
1999
IEEE
15 years 2 months ago
1999
IEEE
Parallel load balancing is studied for problems with certain bisection properties. A class of problems has bisectors if every problem p of weight wp in the class can be subdivided...
AUTOMATICA
2006
14 years 10 months ago
2006
In this note we consider the following problem. Suppose a set of sensors is jointly trying to estimate a process. One sensor takes a measurement at every time step and the measure...