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HPCA
2007
IEEE
16 years 3 months ago
2007
IEEE
3D integration technology greatly increases transistor density while providing faster on-chip communication. 3D implementations of processors can simultaneously provide both laten...
123
Voted
HPCA
2007
IEEE
16 years 3 months ago
2007
IEEE
The emergence of multicore architectures will lead to an increase in the use of multithreaded applications that are prone to synchronization bugs, such as data races. Software sol...
113
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HPCA
2007
IEEE
16 years 3 months ago
2007
IEEE
This paper proposes a hardware transactional memory (HTM) system called LogTM Signature Edition (LogTM-SE). LogTM-SE uses signatures to summarize a transaction's readand writ...
116
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HPCA
2007
IEEE
16 years 3 months ago
2007
IEEE
Performance gains in memory have traditionally been obtained by increasing memory bus widths and speeds. The diminishing returns of such techniques have led to the proposal of an ...
156
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HPCA
2007
IEEE
16 years 3 months ago
2007
IEEE
It is widely accepted that transient failures will appear more frequently in chips designed in the near future due to several factors such as the increased integration scale. On t...