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CODES
2007
IEEE
15 years 4 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
COMSWARE
2007
IEEE
15 years 4 months ago
Situation-Aware Software Engineering for Sensor Networks
—Sensor networks represent a new frontier in technology that holds the promise of unprecedented levels of autonomy in the execution of complex dynamic missions by harnessing the ...
Vir V. Phoha, Shashi Phoha
ICC
2007
IEEE
228views Communications» more  ICC 2007»
15 years 4 months ago
A Non-Cooperative Power Control Game for Secondary Spectrum Sharing
—Limited spectrum resources, inefficient spectrum usage and increasing wireless communication necessitates a paradigm shift from the current fixed spectrum management policy to...
Juncheng Jia, Qian Zhang
IEEEARES
2007
IEEE
15 years 4 months ago
Context-Dependent Access Control for Contextual Information
Abstract— Following Mark Weiser’s vision of ubiquitous computing and calm technology, computer systems should run in the background, preferably without the user noticing it at ...
Christin Groba, Stephan Grob, Thomas Springer
IEEEPACT
2007
IEEE
15 years 4 months ago
The OpenTM Transactional Application Programming Interface
Transactional Memory (TM) simplifies parallel programming by supporting atomic and isolated execution of user-identified tasks. To date, TM programming has required the use of l...
Woongki Baek, Chi Cao Minh, Martin Trautmann, Chri...
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