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DATE
2007
IEEE
15 years 8 months ago
2007
IEEE
Global interconnect temperature keeps rising in the current and future technologies due to self-heating and the adiabatic property of top metal layers. The thermal e ects impact a...
DATE
2007
IEEE
15 years 8 months ago
2007
IEEE
Modern Application Specific Instruction Set Processors (ASIPs) have customizable caches, where the size, associativity and line size can all be customized to suit a particular ap...
DATE
2007
IEEE
15 years 8 months ago
2007
IEEE
Extensive work has been done for optimal management of scratch-pad memory (SPM) all assuming that the SPM is assigned a fixed address space. The main target objects to be placed o...
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DATE
2007
IEEE
15 years 8 months ago
2007
IEEE
Partial reconfiguration allows parts of the reconfigurable chip area to be configured without affecting the rest of the chip. This allows placement of tasks at run time on the rec...
DATE
2007
IEEE
15 years 8 months ago
2007
IEEE
Double-via placement is important for increasing chip manufacturing yield. Commercial tools and recent work have done a great job for it. However, they are found with a limited ca...