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ICCAD
2007
IEEE
15 years 8 months ago
2007
IEEE
Abstract— This paper addresses the module assignment problem in pinlimited designs under the stacked-Vdd circuit paradigm. A partition-based algorithm is presented for efficient...
ICCAD
2007
IEEE
15 years 8 months ago
2007
IEEE
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
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ICCAD
2007
IEEE
15 years 8 months ago
2007
IEEE
Global routing is an important step in the physical design process. In this paper, we propose a new global routing algorithm Archer, which resolves some of the most common problem...
ICCAD
2006
IEEE
15 years 8 months ago
2006
IEEE
Shallow trench isolation (STI) is the mainstream CMOS isolation technology. It uses chemical mechanical planarization (CMP) to remove excess of deposited oxide and attain a planar...
ICCAD
2006
IEEE
15 years 8 months ago
2006
IEEE
Temperature monitoring using thermal sensors is an essential tool for evaluating the thermal behavior and sustaining the reliable operation in high-performance and high-power syst...