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ISQED
2003
IEEE
15 years 4 months ago
2003
IEEE
This paper presents an electrical and thermal performance analysis of System-in-a-Package (SiP) memory/logic implementation platform based on ChipLaminate-Chip (CLC) technology. I...
ICWL
2007
Springer
15 years 5 months ago
2007
Springer
Abstract. This paper proposes a structured blended learning for providing elearning strategies adopted by the Open University of Hong Kong (OUHK). The paper identified the factors ...
ITRE
2005
IEEE
15 years 4 months ago
2005
IEEE
SPATIALCOGNITION
2004
Springer
15 years 4 months ago
2004
Springer
44
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ICEIS
2003
IEEE
15 years 4 months ago
2003
IEEE