5577 search results - page 38 / 1116 » E2K Technology and Implementation |
96
Voted
ICCD
2004
IEEE
15 years 8 months ago
2004
IEEE
This short paper explores an implementation of a new technology called 3D die stacking and describes research activity at Intel. 3D die stacking is the bonding of two die either f...
FPL
2001
Springer
15 years 3 months ago
2001
Springer
System and processor architectures depend on changes in technology. Looking ahead as die density and speed increase, power consumption and on chip interconnection delay become incr...
ITC
1999
IEEE
15 years 3 months ago
1999
IEEE
Static Component Interconnection Test Technology (SCITT) is a new XNOR circuit based technology that is used for board-level interconnection test. SCITT provides an easy test meth...
SAMOS
2007
Springer
15 years 5 months ago
2007
Springer
Abstract— This paper explores the resistance of MOS Current Mode Logic (MCML) against Differential Power Analysis (DPA) attacks. Circuits implemented in MCML, in fact, have uniqu...
107
Voted
FPGA
1998
ACM
15 years 3 months ago
1998
ACM
It has become clear that large embedded con gurable memory arrays will be essential in future FPGAs. Embedded arrays provide high-density high-speed implementations of the storage...