Chemical-mechanical planarization (CMP) and other manufacturing steps in very deep-submicron VLSI have varying effects on device and interconnect features, depending on the local ...
3D integration is an emergent technology that has the potential to greatly increase device density while simultaneously providing faster on-chip communication. 3D fabrication invo...
We present an algorithm for data delivery to mobile sinks in wireless sensor networks. Our algorithm is based on information potentials, which we extend to account for mobility. W...
Branislav Kusy, HyungJune Lee, Martin Wicke, Nikol...
Triangle inequality violations (TIVs) are the effect of packets between two nodes being routed on the longer direct path between them when a shorter detour path through an intermed...
Cristian Lumezanu, Randolph Baden, Neil Spring, Bo...
—Scheduling techniques are often deployed at the network edge to maximize the quality of the video communication while satisfying a given constraint on the maximum high priority ...