Multi-core processors have become an integral part of mainstream high performance computer systems. In parallel, exponentially increasing power density and packaging costs have ne...
Thermal gradients across the die are becoming increasingly prominent as we scale further down into the sub-nanometer regime. While temperature was never a primary concern, its non...
Various architectural power reduction techniques have been proposed for on-chip caches in the last decade. In this paper, we first show that these power reduction techniques can b...
Ja Chun Ku, Serkan Ozdemir, Gokhan Memik, Yehea I....
With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processo...
Kevin Skadron, Mircea R. Stan, Wei Huang, Sivakuma...
As semiconductor manufacturing technology scales to smaller device sizes, the power consumption of clocked digital ICs begins to increase. Dynamic voltage and frequency scaling (D...
Ravishankar Rao, Sarma B. K. Vrudhula, Chaitali Ch...