72 search results - page 9 / 15 » Electrical interconnects revitalized |
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3DIC
2009
IEEE
15 years 4 months ago
2009
IEEE
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
ICRA
2005
IEEE
15 years 3 months ago
2005
IEEE
- We are developing a process to quickly prototype millirobotic systems in which the approach is to identify and develop a construction kit for fabricating almost any design, simil...
IJHCI
2010
14 years 8 months ago
2010
Motivation – Investigations of large-scale outages in the North American interconnected electric system often attribute the causes to three T’s: Trees, Training and Tools. To ...
DATE
2010
IEEE
15 years 2 months ago
2010
IEEE
Abstract—This paper describes a robust and accurate blackbox macromodeling technique, in which the constitutive equations combine both closed-form delay operators and low-order r...
MTDT
1999
IEEE
15 years 1 months ago
1999
IEEE
It seems likely that density concerns will force the DRAM community to consider using radically different schemes for the implementation of memory devices. We propose using nano-s...