—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...
Xin Zhao, Dean L. Lewis, Hsien-Hsin S. Lee, Sung K...
Conventional ASIC designs are hard to be customized. Therefore DSP core-based ASIC design has potentially large payoff. This approach not only supports improved performance but al...
Ya-Lan Tsao, Ming Hsuan Tan, Jun-Xian Teng, Shyh-J...
The realization of fast datapaths in signal processing environments requires fastest, power efficient logic styles with synchronous behavior. This paper presents a method to combi...
We consider active leakage power dissipation in FPGAs and present a “no cost” approach for active leakage reduction. It is well-known that the leakage power consumed by a digi...
Optimizing user experience for streaming video applications on handheld devices is a significant research challenge. In this paper, we propose an integrated power management appr...
Shivajit Mohapatra, Radu Cornea, Nikil D. Dutt, Al...