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» Elements of low power design for integrated systems
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SBCCI
2009
ACM
131views VLSI» more  SBCCI 2009»
15 years 6 months ago
Twin logic gates: improved logic reliability by redundancy concerning gate oxide breakdown
Because of the aggressive scaling of integrated circuits and the given limits of atomic scales, circuit designers have to become more and more aware of the arising reliability and...
Hagen Sämrow, Claas Cornelius, Frank Sill, An...
ACMACE
2005
ACM
15 years 3 months ago
AI middleware as means for improving gameplay
Current commercial AI middleware are still far from being a generic and flexible tool for developing computer games. Also the literature lacks proposals in this field. In this w...
Börje Karlsson, Bruno Feijó
BMCBI
2007
166views more  BMCBI 2007»
15 years 1 months ago
Data handling strategies for high throughput pyrosequencers
Background: New high throughput pyrosequencers such as the 454 Life Sciences GS 20 are capable of massively parallelizing DNA sequencing providing an unprecedented rate of output ...
Gabriele A. Trombetti, Raoul J. P. Bonnal, Ermanno...
GIS
2008
ACM
16 years 3 months ago
GISolve toolkit: advancing GIS through cyberinfrastructure
Cyberinfrastructure integrates information and communication technologies to enable high-performance, distributed, and collaborative knowledge discovery, and promises to revolutio...
Shaowen Wang
ISQED
2007
IEEE
236views Hardware» more  ISQED 2007»
15 years 8 months ago
3DFFT: Thermal Analysis of Non-Homogeneous IC Using 3D FFT Green Function Method
Due to the roaring power dissipation and gaining popularity of 3D integration, thermal dissipation has been a critical concern of modern VLSI design. The availability for chip-lev...
Dongkeun Oh, Charlie Chung-Ping Chen, Yu Hen Hu