The number of embedded systems is increasing and a remarkable percentage is designed as mobile applications. For the latter, the energy consumption is a limiting factor because of...
Stefan Steinke, Lars Wehmeyer, Bo-Sik Lee, Peter M...
In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...
—Huge new design challenges for system-on-chip (SoC) are the result of decreasing time-to-market coupled with rapidly increasing gate counts and embedded software representing 50...
In this paper, we propose a novel hardware caching technique, called switch directory, to reduce the communication latency in CC-NUMA multiprocessors. The main idea is to implemen...
In processors that do not support floating-point instructions, using fixed-point arithmetic instead of floating-point emulation trades off computation accuracy for execution spe...