As huge quantities of documents have become available, services using natural language processing technologies trained by huge corpora have emerged, such as information retrieval ...
Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch Through-Silicon Via (TSV) for advanced interconnections. The ...
M. Puech, Jean-Marc Thevenoud, J. M. Gruffat, N. L...
A spirited panel was recently held at the 10th International Web Caching and Content Distribution workshop on the future of P2P in content distribution [1]. After more than ten ye...
Pablo Rodriguez, See-Mong Tan, Christos Gkantsidis
The main task of this follow-up study was to describe teachers' expectations, experiences and possible changes in the pedagogical use of ICT. As a part of an ICT development p...
Being E-commerce one of the most critical Internet application, it is fundamental to employ technologies which guarantee not only secure transactions but also an adequate quality ...
Mario Bravetti, Roberto Lucchi, Gianluigi Zavattar...