1943 search results - page 271 / 389 » End-to-End Integration Testing |
131
Voted
ICCAD
2008
IEEE
16 years 1 months ago
2008
IEEE
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
153
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ICCAD
2006
IEEE
16 years 1 months ago
2006
IEEE
Most existing RCL−1 circuit reductions stamp inverse inductance L−1 elements by a second-order nodal analysis (NA). The NA formulation uses nodal voltage variables and describ...
111
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ICCAD
2002
IEEE
16 years 1 months ago
2002
IEEE
Abstract—A robust, efficient, and accurate inductance extraction and simulation tool, INDUCTWISE, is developed and described in this paper. This work advances the state-of-the-ar...
183
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CVPR
2010
IEEE
16 years 26 days ago
2010
IEEE
Object localization in an image is usually handled by searching for an optimal subwindow that tightly covers the object of interest. However, the subwindows considered in previous ...
203
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CVPR
2010
IEEE
16 years 24 days ago
2010
IEEE
This paper studies the problem of learning a full range of pairwise affinities gained by integrating local grouping cues for spectral segmentation. The overall quality of the spect...