1943 search results - page 342 / 389 » End-to-End Integration Testing |
84
Voted
ISCAS
2006
IEEE
2006
IEEE
Microelectromechanical systems in 3D SOI-CMOS: sensing electronics embedded in mechanical structures
15 years 6 months ago
— We discuss the design of CMOS MEMS in a 3D SOI-CMOS technology. We present layout architectures, preliminary mechanics modeling using finite element analysis and release proce...
100
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CASES
2006
ACM
15 years 6 months ago
2006
ACM
Designers of SoCs with non-digital components, such as analog or MEMS devices, can currently use high-level system design languages, such as SystemC, to model only the digital par...
114
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PLDI
2005
ACM
15 years 6 months ago
2005
ACM
Reuse of existing code from class libraries and frameworks is often difficult because APIs are complex and the client code required to use the APIs can be hard to write. We obser...
103
Voted
SLIP
2005
ACM
15 years 6 months ago
2005
ACM
We propose in this paper a multilevel full-chip routing algorithm that improves testability and diagnosability, manufacturability, and signal integrity for yield enhancement. Two ...
123
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FPGA
2005
ACM
15 years 6 months ago
2005
ACM
Creating a new FPGA is a challenging undertaking because of the significant effort that must be spent on circuit design, layout and verification. It currently takes approximately ...