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3DIC
2009
IEEE
279views Hardware» more  3DIC 2009»
16 years 29 days ago
Compact modelling of Through-Silicon Vias (TSVs) in three-dimensional (3-D) integrated circuits
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
Roshan Weerasekera, Matt Grange, Dinesh Pamunuwa, ...
DATE
2009
IEEE
130views Hardware» more  DATE 2009»
16 years 27 days ago
Evaluating UML2 modeling of IP-XACT objects for automatic MP-SoC integration onto FPGA
—IP-XACT is a standard for describing intellectual property metadata for System-on-Chip (SoC) integration. Reesearchers have proposed visualizing and abstracting IP-XACT objects ...
Tero Arpinen, Tapio Koskinen, Erno Salminen, Timo ...
APSEC
2004
IEEE
15 years 10 months ago
An Integrated Model of ISO 9001: 2000 and CMMI for ISO Registered Organizations
ISO 9001 is a standard for quality management systems while CMMI is a model for process improvement. If an organization that has achieved ISO registration wishes to improve proces...
Chanwoo Yoo, Junho Yoon, Byungjeong Lee, Chong-Won...
MCS
2006
Springer
15 years 6 months ago
Architectural concepts and Design Patterns for behavior modeling and integration
The design of the control software for complex systems is a difficult task. It requires the modeling, the simulation, the integration and the adaptation of a multitude of intercon...
Jean-Marc Perronne, Laurent Thiry, Bernard Thirion
519
Voted
IJMI
2010
212views more  IJMI 2010»
15 years 4 months ago
Integrating the SE and HCI models in the human factors engineering cycle for re-engineering Computerized Physician Order Entry s
The integration of Software Engineering (SE) and Human-Computer Interaction (HCI) methods and models is an interesting means for modelling an organization's activities, with ...
Stéphanie Bernonville, Christophe Kolski, N...