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MACOM
2010
14 years 11 months ago
Quality of Service Oriented Analysis of Cross-Layer Design in Wireless Ad Hoc Networks
Abstract. In wireless ad hoc networks, cross-layer design aims at reducing multiple access interference and thus obtaining a higher spatial reuse. In order to identify the most sui...
Ulrike Korger, Christian Hartmann, Katsutoshi Kusu...
DCC
2007
IEEE
16 years 1 months ago
Lifting of divisible designs
The aim of this paper is to present a construction of t-divisible designs for t > 3, because such divisible designs seem to be missing in the literature. To this end, tools suc...
Andrea Blunck, Hans Havlicek, Corrado Zanella
ICCAD
2009
IEEE
154views Hardware» more  ICCAD 2009»
14 years 11 months ago
Pad assignment for die-stacking System-in-Package design
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
138
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EDUTAINMENT
2007
Springer
15 years 8 months ago
Usability Test of Immersion for Augmented Reality Based Product Design
In this paper, we evaluate the usability of multimodal feedback for enhancing immersion in augmented reality (AR) based product design environments, introduced in the paper [1]. We...
Taejin Ha, Yoonje Chang, Woontack Woo
ASPDAC
2004
ACM
141views Hardware» more  ASPDAC 2004»
15 years 7 months ago
An approach for reducing dynamic power consumption in synchronous sequential digital designs
— The problem of minimizing dynamic power consumption by scaling down the supply voltage of computational elements off critical paths is widely addressed in the literature for th...
Noureddine Chabini, Wayne Wolf