Abstract. In wireless ad hoc networks, cross-layer design aims at reducing multiple access interference and thus obtaining a higher spatial reuse. In order to identify the most sui...
Ulrike Korger, Christian Hartmann, Katsutoshi Kusu...
The aim of this paper is to present a construction of t-divisible designs for t > 3, because such divisible designs seem to be missing in the literature. To this end, tools suc...
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
In this paper, we evaluate the usability of multimodal feedback for enhancing immersion in augmented reality (AR) based product design environments, introduced in the paper [1]. We...
— The problem of minimizing dynamic power consumption by scaling down the supply voltage of computational elements off critical paths is widely addressed in the literature for th...