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CODES
2007
IEEE
16 years 18 days ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
137
Voted
BMCBI
2004
75views more  BMCBI 2004»
15 years 6 months ago
Structural characterization of genomes by large scale sequence-structure threading
Background: Using sequence-structure threading we have conducted structural characterization of complete proteomes of 37 archaeal, bacterial and eukaryotic organisms (including wo...
Artem Cherkasov, Steven J. M. Jones
WOSP
2010
ACM
16 years 1 months ago
A general result for deriving product-form solutions in markovian models
In this paper we provide a general method to derive productform solutions for stochastic models. We take inspiration from the Reversed Compound Agent Theorem [14] and we provide a...
Andrea Marin, Maria Grazia Vigliotti
SEM
2004
Springer
15 years 11 months ago
PlanetSim: A New Overlay Network Simulation Framework
Abstract. Current research in peer to peer systems is lacking appropriate environments for simulation and experimentation of large scale overlay services. This has led to a plethor...
Pedro García López, Carles Pairot, R...
WSC
2004
15 years 7 months ago
Implementing the High Level Architecture in the Virtual Test Bed
The Virtual Test Bed (VTB) is a prototype of a virtual engineering environment to study operations of current and future space vehicles, spaceports, and ranges. The HighLevel Arch...
José A. Sepúlveda, Luis C. Rabelo, J...