This paper presents an electrical and thermal performance analysis of System-in-a-Package (SiP) memory/logic implementation platform based on ChipLaminate-Chip (CLC) technology. I...
Michael X. Wang, Katsuharu Suzuki, Wayne Wei-Ming ...
A critical aspect of semiconductor manufacturing is the design and analysis of material handling and production control polices to optimize fab performance. As wafer sizes have in...
We analyze the bit error probability of multiuser demodulators for directsequence binary phase-shift-keying (DS/BPSK) CDMA channel with additive gaussian noise. The problem of mul...
Abstract--Distributed medium access control (MAC) is essential for a wireless network without a central controller. In previous work of the authors, a distributed MAC scheme has be...
Hai Jiang, Ping Wang, Weihua Zhuang, H. Vincent Po...
In this paper, a machine learning approach to support the user during the correction of the layout analysis is proposed. Layout analysis is the process of extracting a hierarchica...