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DAC
2006
ACM
14 years 7 months ago
Novel full-chip gridless routing considering double-via insertion
As the technology node advances into the nanometer era, via-open defects are one of the dominant failures. To improve via yield and reliability, redundant-via insertion is a highl...
Huang-Yu Chen, Mei-Fang Chiang, Yao-Wen Chang, Lum...
CP
2008
Springer
13 years 7 months ago
Search Strategies for Rectangle Packing
Rectangle (square) packing problems involve packing all squares with sizes 1 × 1 to n × n into the minimum area enclosing rectangle (respectively, square). Rectangle packing is a...
Helmut Simonis, Barry O'Sullivan
TE
2010
89views more  TE 2010»
13 years 1 months ago
An Electrical Engineering Summer Academy for Middle School and High School Students
The Electrical Engineering Summer Academy for Pre-College Students was held at the University of Tulsa from June 11th through June 15th , 2007. Of the 20 students accepted, 19 par...
Peter LoPresti, Theodore W. Manikas, Jeff Kohlbeck
ACMIDC
2011
12 years 10 months ago
LightUp: a low-cost, multi-age toolkit for learning and prototyping electronics
LightUp is a constructionist platform to teach novices about electronics, and also a low-cost rapid-prototyping platform for more advanced users. The LightUp kit contains many bas...
Zain Asgar, Joshua Chan, Chang Liu, Paulo Blikstei...
MICRO
2009
IEEE
160views Hardware» more  MICRO 2009»
14 years 1 months ago
Variation-tolerant non-uniform 3D cache management in die stacked multicore processor
Process variations in integrated circuits have significant impact on their performance, leakage and stability. This is particularly evident in large, regular and dense structures...
Bo Zhao, Yu Du, Youtao Zhang, Jun Yang 0002