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DATE
2006
IEEE
16 years 7 days ago
2006
IEEE
The power density inside high performance systems continues to rise with every process technology generation, thereby increasing the operating temperature and creating “hot spot...
165
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DSN
2006
IEEE
16 years 7 days ago
2006
IEEE
The advent of deep sub-micron technology has exacerbated reliability issues in on-chip interconnects. In particular, single event upsets, such as soft errors, and hard faults are ...
HICSS
2006
IEEE
16 years 7 days ago
2006
IEEE
