4616 search results - page 369 / 924 » Extreme Components Analysis |
156
Voted
AIPS
2009
15 years 7 months ago
2009
Current state-of-the-art planners solve problems, easy and hard alike, by search, expanding hundreds or thousands of nodes. Yet, given the ability of people to solve easy problems...
188
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TC
2008
15 years 6 months ago
2008
Abstract-- Preventing silicon chips from negative, even disastrous thermal hazards has become increasingly challenging these days; considering thermal effects early in the design c...
166
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TECS
2008
15 years 6 months ago
2008
straction SUDEEP PASRICHA and NIKIL DUTT University of California, Irvine and MOHAMED BEN-ROMDHANE Newport Media Inc. Currently, system-on-chip (SoC) designs are becoming increasin...
174
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ICCAD
2010
IEEE
15 years 4 months ago
2010
IEEE
Extreme technology scaling in silicon devices drastically affects reliability, particularly because of runtime failures induced by transistor wearout. Currently available online t...
237
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GRID
2010
Springer
15 years 3 months ago
2010
Springer
The Grid paradigm of accessing heterogeneous distributed resources proved to be extremely effective, as many organizations are relying on Grid middlewares for their computational ...