In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
In this paper we present a methodology that is based on SystemC [1] for rapid prototyping to greatly enhance and accelerate the exploration of complex systems to optimize the syst...
Recent years have seen a burgeoning interest in embedded wireless sensor networks with applications ranging from habitat monitoring to medical applications. Wireless sensor networ...
Mark Hempstead, Nikhil Tripathi, Patrick Mauro, Gu...
We present a flexible method for bus and network on chip performance analysis, which is based on the adaptation of workload models to resemble various applications. Our analysis m...
Very recent activities in the IETF and in the Routing Research Group (RRG) of the IRTG focus on defining a new Internet architecture, in order to solve scalability issues related ...