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» Fast Simulation Techniques for Design Space Exploration
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DAC
2012
ACM
13 years 7 days ago
Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
Moongon Jung, David Z. Pan, Sung Kyu Lim
DATE
2006
IEEE
202views Hardware» more  DATE 2006»
15 years 3 months ago
Automatic systemC design configuration for a faster evaluation of different partitioning alternatives
In this paper we present a methodology that is based on SystemC [1] for rapid prototyping to greatly enhance and accelerate the exploration of complex systems to optimize the syst...
Nico Bannow, Karsten Haug, Wolfgang Rosenstiel
ISCA
2005
IEEE
172views Hardware» more  ISCA 2005»
15 years 3 months ago
An Ultra Low Power System Architecture for Sensor Network Applications
Recent years have seen a burgeoning interest in embedded wireless sensor networks with applications ranging from habitat monitoring to medical applications. Wireless sensor networ...
Mark Hempstead, Nikhil Tripathi, Patrick Mauro, Gu...
DSD
2006
IEEE
99views Hardware» more  DSD 2006»
15 years 1 months ago
Flexible Bus and NoC Performance Analysis with Configurable Synthetic Workloads
We present a flexible method for bus and network on chip performance analysis, which is based on the adaptation of workload models to resemble various applications. Our analysis m...
Rikard Thid, Ingo Sander, Axel Jantsch
CONEXT
2007
ACM
15 years 1 months ago
On the cost of caching locator/ID mappings
Very recent activities in the IETF and in the Routing Research Group (RRG) of the IRTG focus on defining a new Internet architecture, in order to solve scalability issues related ...
Luigi Iannone, Olivier Bonaventure