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VLSID
2002
IEEE
114views VLSI» more  VLSID 2002»
15 years 11 months ago
Embedded DRAM (eDRAM) Power-Energy Estimation for System-on-a-Chip (SoC) Applications
Embedded DRAM (eDRAM) power-energy estimation is presented for system-on-a-chip (SOC) applications. The main feature is the signal swing based analytic (SSBA) model, which improve...
Yong-Ha Park, Jeonghoon Kook, Hoi-Jun Yoo
VLSID
2008
IEEE
128views VLSI» more  VLSID 2008»
15 years 11 months ago
Addressing the Challenges of Synchronization/Communication and Debugging Support in Hardware/Software Cosimulation
With increasing adoption of Electronic System Level (ESL) tools, effective design and validation time has reduced to a considerable extent. Cosimulation is found to be a principal...
Banit Agrawal, Timothy Sherwood, Chulho Shin, Simo...
VLSID
2004
IEEE
292views VLSI» more  VLSID 2004»
15 years 11 months ago
NoCGEN: A Template Based Reuse Methodology for Networks on Chip Architecture
In this paper, we describe NoCGEN, a Network On Chip (NoC) generator, which is used to create a simulatable and synthesizable NoC description. NoCGEN uses a set of modularised rou...
Jeremy Chan, Sri Parameswaran
VLSID
2002
IEEE
138views VLSI» more  VLSID 2002»
15 years 11 months ago
ETAM++: Extended Transition Activity Measure for Low Power Address Bus Designs
Interconnection networks in Systems-On-Chip begin to have a non-negligible impact on the power consumption of a whole system. This is because of increasing inter-wire capacitances...
Haris Lekatsas, Jörg Henkel
ICCAD
2008
IEEE
161views Hardware» more  ICCAD 2008»
15 years 8 months ago
A low-overhead fault tolerance scheme for TSV-based 3D network on chip links
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...