High frequency digital LSIs usually consist of many subcircuits coupled with multi-conductor interconnects embedded in the substrate. They sometimes cause serious problems of the ...
With the growing complexity in consumer embedded products and the improvements in process technology, Multi-Processor SystemOn-Chip (MPSoC) architectures have become widespread. T...
David Atienza, Pablo Garcia Del Valle, Giacomo Pac...
Interconnects have deserved attention as a source of crosstalk to other interconnects, but have been ignored as a source of substrate noise. In this paper, we evaluate the importa...
Ferran Martorell, Diego Mateo, Xavier Aragon&egrav...
On-chip global interconnections in very deep submicron technology (VDSM) ICs are becoming more sensitive and prone to errors caused by power supply noise, crosstalk noise, delay v...
Daniele Rossi, Steven V. E. S. van Dijk, Richard P...
This paper presents a fault tolerant design technique for the clockless wave pipeline. The specific architectural model investigated in this paper is the two-phase clockless asyn...
T. Feng, Byoungjae Jin, J. Wang, Nohpill Park, Yon...