1866 search results - page 263 / 374 » Flexibly Interleaving Processes |
108
Voted
CORR
2008
Springer
15 years 3 months ago
2008
Springer
This paper presents one MEMS design tool with total six design flows, which makes it possible that the MEMS designers are able to choose the most suitable design flow for their sp...
89
Voted
CORR
2008
Springer
15 years 3 months ago
2008
Springer
Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch Through-Silicon Via (TSV) for advanced interconnections. The ...
113
Voted
DKE
2010
15 years 3 months ago
2010
Workflow analysis is indispensable to capture modeling errors in workflow designs. While several workflow analysis approaches have been defined previously, these approaches do not...
172
Voted
GRID
2008
Springer
15 years 3 months ago
2008
Springer
A myriad of recent activities can be seen towards dynamic workflow composition for processing complex and data intensive problems. Meanwhile, the simultaneous emergence of the gri...
146
click to vote
COMCOM
2006
15 years 3 months ago
2006
Recent technological advances in sensors, low-power integrated circuits, and wireless communications have enabled the design of lowcost, miniature, lightweight, and intelligent ph...