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DAC
2004
ACM
16 years 5 months ago
Compact thermal modeling for temperature-aware design
Thermal design in sub-100nm technologies is one of the major challenges to the CAD community. In this paper, we first introduce the idea of temperature-aware design. We then propo...
Wei Huang, Mircea R. Stan, Kevin Skadron, Karthik ...
DAC
2004
ACM
16 years 5 months ago
Reliability-driven layout decompaction for electromigration failure avoidance in complex mixed-signal IC designs
The negative effect of electromigration on signal and power line lifetime and functional reliability is an increasingly important problem for the physical design of integrated cir...
Goeran Jerke, Jürgen Scheible, Jens Lienig
DAC
2004
ACM
16 years 5 months ago
Placement feedback: a concept and method for better min-cut placements
The advent of strong multi-level partitioners has made topdown min-cut placers a favored choice for modern placer implementations. We examine terminal propagation, an important st...
Andrew B. Kahng, Sherief Reda
DAC
2004
ACM
16 years 5 months ago
FPGA power reduction using configurable dual-Vdd
Power optimization is of growing importance for FPGAs in nanometer technologies. Considering dual-Vdd technique, we show that configurable power supply is required to obtain a sat...
Fei Li, Yan Lin, Lei He
DAC
2004
ACM
16 years 5 months ago
A method for correcting the functionality of a wire-pipelined circuit
As across-chip interconnect delays can exceed a clock cycle, wire pipelining becomes essential in high performance designs. Although it allows higher clock frequencies, it may cha...
Vidyasagar Nookala, Sachin S. Sapatnekar
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