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DAC
2011
ACM
14 years 4 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
AIM
2006
15 years 5 months ago
Observing the use of BPM tools: A step towards flexibility
: The development of the tools of Business Process Management (BPM) arises from the spread of the notion of process in the management universe. The application of BPM to strategic ...
Joseph Heili, Jean-Mathias Heraud, Laure France
IEEEPACT
2006
IEEE
15 years 10 months ago
Whole-program optimization of global variable layout
On machines with high-performance processors, the memory system continues to be a performance bottleneck. Compilers insert prefetch operations and reorder data accesses to improve...
Nathaniel McIntosh, Sandya Mannarswamy, Robert Hun...
IM
2007
15 years 5 months ago
A Generic Application-Oriented Performance Instrumentation for Multi-Tier Environments
— In this paper, we present a design for a generic, open, application-oriented performance instrumentation of multitier applications. Measurements are performed through configur...
Markus Schmid, Marcus Thoss, Thomas Termin, Reinho...
WCRE
1999
IEEE
15 years 8 months ago
Chava: Reverse Engineering and Tracking of Java Applets
Java applets have been used increasingly on web sites to perform client-side processing and provide dynamic content. While many web site analysis tools are available, their focus ...
Jeffrey L. Korn, Yih-Farn Chen, Eleftherios Koutso...