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ICCAD
2005
IEEE
117views Hardware» more  ICCAD 2005»
16 years 1 months ago
IMF: interconnect-driven multilevel floorplanning for large-scale building-module designs
Abstract— We present in this paper a new interconnect-driven multilevel floorplanning, called IMF, to handle large-scale building-module designs. Unlike the traditional multilev...
Tung-Chieh Chen, Yao-Wen Chang, Shyh-Chang Lin
ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
16 years 1 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
SOSP
2005
ACM
16 years 1 months ago
Capturing, indexing, clustering, and retrieving system history
We present a method for automatically extracting from a running system an indexable signature that distills the essential characteristic from a system state and that can be subjec...
Ira Cohen, Steve Zhang, Moisés Goldszmidt, ...
SOSP
2005
ACM
16 years 1 months ago
IRON file systems
Commodity file systems trust disks to either work or fail completely, yet modern disks exhibit more complex failure modes. We suggest a new fail-partial failure model for disks, ...
Vijayan Prabhakaran, Lakshmi N. Bairavasundaram, N...
CVPR
2010
IEEE
16 years 26 days ago
Toward Coherent Object Detection And Scene Layout Understanding
Detecting objects in complex scenes while recovering the scene layout is a critical functionality in many vision-based applications. Inspired by the work of [18], we advocate the ...
Yingze Bao, Min Sun, Silvio Savarese
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