Abstract— We present in this paper a new interconnect-driven multilevel floorplanning, called IMF, to handle large-scale building-module designs. Unlike the traditional multilev...
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
We present a method for automatically extracting from a running system an indexable signature that distills the essential characteristic from a system state and that can be subjec...
Commodity file systems trust disks to either work or fail completely, yet modern disks exhibit more complex failure modes. We suggest a new fail-partial failure model for disks, ...
Vijayan Prabhakaran, Lakshmi N. Bairavasundaram, N...
Detecting objects in complex scenes while recovering the scene layout is a critical functionality in many vision-based applications. Inspired by the work of [18], we advocate the ...