165 search results - page 12 / 33 » Heterogeneous systems on chip and systems in package |
GLVLSI
2005
IEEE
15 years 3 months ago
2005
IEEE
3D packaging via System-On-Package (SOP) is a viable alternative to System-On-Chip (SOC) to meet the rigorous requirements of today’s mixed signal system integration. In this wo...
ASPDAC
2009
ACM
15 years 4 months ago
2009
ACM
— Multiprocessors on a chip are the reality of these days. Semiconductor industry has recognized this approach as the most efficient in order to exploit chip resources, but the ...
DATE
2006
IEEE
15 years 3 months ago
2006
IEEE
In recent years, increasing manufacturing density has allowed the development of Multi-Processor Systems-on-Chip (MPSoCs). Application-Specific Instruction Set Processors (ASIPs)...
80
Voted
DATE
2009
IEEE
15 years 4 months ago
2009
IEEE
—The sustained push for performance, transistor count, and instruction level parallelism has reached a point where chip level power density issues are at the forefront of design ...
DATE
2005
IEEE
14 years 11 months ago
2005
IEEE
Developing a functional prototype of a system-on-chip provides a unifying vehicle for model validation and system refinement. Keeping the prototype executable everal abstraction l...