165 search results - page 19 / 33 » Heterogeneous systems on chip and systems in package |
ICPPW
2002
IEEE
15 years 2 months ago
2002
IEEE
Distributed Shared Memory (DSM) systems provide a logically shared memory over physically distributed memory to enable parallel computation on Networks of Workstations (NOWs). In ...
104
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HPCA
2012
IEEE
13 years 5 months ago
2012
IEEE
Lowering supply voltage is one of the most effective techniques for reducing microprocessor power consumption. Unfortunately, at low voltages, chips are very sensitive to process ...
100
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TCAD
2008
14 years 9 months ago
2008
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
107
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INTEGRATION
2008
14 years 9 months ago
2008
With the growing complexity in consumer embedded products, new tendencies forecast heterogeneous Multi-Processor SystemsOn-Chip (MPSoCs) consisting of complex integrated component...
99
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AADEBUG
2005
Springer
14 years 11 months ago
2005
Springer
Increased reuse of software components has led to a software mishmash as existing packages are used as building blocks for new systems. Current debuggers cannot cope with the intr...