165 search results - page 29 / 33 » Heterogeneous systems on chip and systems in package |
CODES
2007
IEEE
15 years 3 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
MICRO
2007
IEEE
15 years 3 months ago
2007
IEEE
Aggressive technology scaling over the years has helped improve processor performance but has caused a reduction in processor reliability. Shrinking transistor sizes and lower sup...
106
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BMCBI
2008
14 years 9 months ago
2008
Background: A survey of microarray databases reveals that most of the repository contents and data models are heterogeneous (i.e., data obtained from different chip manufacturers)...
CLEIEJ
2006
14 years 9 months ago
2006
This paper describes JADIMA (Java Distributed Machine), a collaborative platform to construct high performance distributed JAVA applications. JADIMA is a system that automatically...
105
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IPSN
2007
Springer
15 years 3 months ago
2007
Springer
FlashDB is a self-tuning database optimized for sensor networks using NAND flash storage. In practical systems flash is used in different packages such as on-board flash chips,...