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» Heterogeneous systems on chip and systems in package
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EDCC
2008
Springer
13 years 8 months ago
A Transient-Resilient System-on-a-Chip Architecture with Support for On-Chip and Off-Chip TMR
The ongoing technological advances in the semiconductor industry make Multi-Processor System-on-a-Chips (MPSoCs) more attractive, because uniprocessor solutions do not scale satis...
Roman Obermaisser, Hubert Kraut, Christian El Sall...
DAC
2001
ACM
14 years 7 months ago
Automatic Generation of Application-Specific Architectures for Heterogeneous Multiprocessor System-on-Chip
We present a design flow for the generation of application-specific multiprocessor architectures. In the flow, architectural parameters are first extracted from a high-level syste...
Damien Lyonnard, Sungjoo Yoo, Amer Baghdadi, Ahmed...
ISLPED
2009
ACM
110views Hardware» more  ISLPED 2009»
14 years 23 days ago
SOI, interconnect, package, and mainboard thermal characterization
This paper presents an evaluation to determine the importance of the accurate thermal characterization for several elements of a semiconductor device. Specifically, it evaluates ...
Joseph Nayfach-Battilana, Jose Renau
GIL
2009
13 years 4 months ago
A Software Package for Managing and Evaluating DNA Sequence and Microsatellite Data
Abstract: We have surveyed three molecular biology labs in Germany and Vietnam to evaluate practical problems in the management of molecular genetics data. These labs are generatin...
Truong Van Chi Cong, Zhivko Duchev, Eildert Groene...
DATE
2009
IEEE
107views Hardware» more  DATE 2009»
14 years 1 months ago
User-centric design space exploration for heterogeneous Network-on-Chip platforms
- In this paper, we present a design methodology for automatic platform generation of future heterogeneous systems where communication happens via the Network-onChip (NoC) approach...
Chen-Ling Chou, Radu Marculescu