34 search results - page 6 / 7 » High Density Through Silicon Via (TSV) |
ASPDAC
2011
ACM
12 years 10 months ago
2011
ACM
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. Since the device layers are processed in sequent...
ICC
2007
IEEE
14 years 21 days ago
2007
IEEE
—In a wireless sensor network, the network lifetime is an important issue when the size of the network is large. In order to make the network scalable, it is divided into a numbe...
HICSS
2003
IEEE
13 years 11 months ago
2003
IEEE
Telemedicine is advocated for its potential to improve the accessibility and quality of health care delivery while lowering costs [1]. Although the potential benefits of telemedic...
DAC
2009
ACM
14 years 7 months ago
2009
ACM
Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...
ASAP
2011
IEEE
12 years 6 months ago
2011
IEEE
—The domain of vision and navigation often includes applications for feature tracking as well as simultaneous localization and mapping (SLAM). As these problems require computati...