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ISCA
2011
IEEE
522views Hardware» more  ISCA 2011»
14 years 1 months ago
CPPC: correctable parity protected cache
Due to shrinking feature sizes processors are becoming more vulnerable to soft errors. Write-back caches are particularly vulnerable since they hold dirty data that do not exist i...
Mehrtash Manoochehri, Murali Annavaram, Michel Dub...
3DIC
2009
IEEE
169views Hardware» more  3DIC 2009»
15 years 2 months ago
3-D memory organization and performance analysis for multi-processor network-on-chip architecture
Several forms of processor memory organizations have been in use to optimally access off-chip memory systems mainly the Hard disk drives (HDD). Recent trends show that the solid s...
Awet Yemane Weldezion, Zhonghai Lu, Roshan Weerase...
ISSS
2002
IEEE
194views Hardware» more  ISSS 2002»
15 years 2 months ago
Managing Dynamic Concurrent Tasks in Embedded Real-Time Multimedia Systems
This paper addresses the problem of mapping an application, which is highly dynamic in the future, onto a heterogeneous multiprocessor platform in an energy efficient way. A two-p...
Rudy Lauwereins, Chun Wong, Paul Marchal, Johan Vo...
MICRO
2007
IEEE
128views Hardware» more  MICRO 2007»
15 years 3 months ago
A Framework for Providing Quality of Service in Chip Multi-Processors
The trends in enterprise IT toward service-oriented computing, server consolidation, and virtual computing point to a future in which workloads are becoming increasingly diverse i...
Fei Guo, Yan Solihin, Li Zhao, Ravishankar Iyer
CODES
2007
IEEE
15 years 4 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick