537 search results - page 85 / 108 » High-precision interconnect analysis |
103
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ICCAD
2004
IEEE
15 years 10 months ago
2004
IEEE
Closed formed expressions for buffered interconnect delay approximation have been around for some time. However, previous approaches assume that buffers are free to be placed anyw...
ICCAD
2004
IEEE
15 years 10 months ago
2004
IEEE
We propose two new FPGA routing switch designs that are programmable to operate in three different modes: highspeed, low-power or sleep. High-speed mode provides similar power an...
173
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3DIC
2009
IEEE
15 years 8 months ago
2009
IEEE
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
126
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3DIC
2009
IEEE
15 years 8 months ago
2009
IEEE
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
CCS
2009
ACM
15 years 8 months ago
2009
ACM
The vast expansion of interconnectivity with the Internet and the rapid evolution of highly-capable but largely insecure mobile devices threatens cellular networks. In this paper,...