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VLSID
2009
IEEE
144views VLSI» more  VLSID 2009»
15 years 10 months ago
Exploring Carbon Nanotube Bundle Global Interconnects for Chip Multiprocessor Applications
The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming a serious performance bottleneck in ultra-deep submicron (UDSM) technologies. C...
Sudeep Pasricha, Nikil Dutt, Fadi J. Kurdahi
PERCOM
2007
ACM
15 years 9 months ago
A Cooperative MAC Protocol for Ad Hoc Wireless Networks
Cooperative communications fully leverages the broadcast nature of the wireless channel and spatial diversity, thereby achieving tremendous improvements in system capacity and dela...
Thanasis Korakis, Zhifeng Tao, Yevgeniy Slutskiy, ...
DATE
2009
IEEE
155views Hardware» more  DATE 2009»
15 years 4 months ago
Dynamic thermal management in 3D multicore architectures
— Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlike transistors, have not followed the same trend. Designing 3D stack architec...
Ayse Kivilcim Coskun, José L. Ayala, David ...
IROS
2009
IEEE
132views Robotics» more  IROS 2009»
15 years 4 months ago
Segregation in swarms of mobile robots based on the Brazil nut effect
— We study a simple algorithm inspired by the Brazil nut effect for achieving segregation in a swarm of mobile robots. The algorithm lets each robot mimic a particle of a certain...
Roderich Groß, Stéphane Magnenat, Fra...
ADBIS
2009
Springer
143views Database» more  ADBIS 2009»
15 years 4 months ago
Cost-Based Vectorization of Instance-Based Integration Processes
The inefficiency of integration processes—as an abstraction of workflow-based integration tasks—is often reasoned by low resource utilization and significant waiting times f...
Matthias Böhm, Dirk Habich, Steffen Preissler...