We describe an efficient, top-down strategy for overlap removal and floorplan repair which repairs overlaps in floorplans produced by placement algorithms or rough floorplanni...
Kristofer Vorwerk, Andrew A. Kennings, Doris T. Ch...
The thermal problem has been emerged as one of the key issues for next-generation IC design. In this paper, we propose a scheme to achieve better thermal distribution for partitio...
In this paper, we propose a new linear programming based timing driven placement framework for high performance designs. Our LP framework is mainly net-based, but it takes advanta...
An efficient approach to full-wave impedance extraction is developed that accounts for substrate effects through the use of two-layer media Green's functions in a mixed-poten...
With the thermal effect, improper analog placements may degrade circuit performance because the thermal impact from power devices can affect electrical characteristics of the ther...
Po-Hung Lin, Hongbo Zhang, Martin D. F. Wong, Yao-...