111 search results - page 6 / 23 » IPR: An Integrated Placement and Routing Algorithm |
189
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DAC
2011
ACM
13 years 11 months ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
GLVLSI
2003
IEEE
15 years 4 months ago
2003
IEEE
In dense integrated circuit designs, management of routing congestion is essential; an over congested design may be unroutable. Many factors influence congestion: placement, rout...
FPGA
2001
ACM
15 years 4 months ago
2001
ACM
As integrated circuits are migrated to more advanced technologies, it has become clear that crosstalk is an important physical phenomenon that must be taken into account. Crosstal...
110
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SLIP
2005
ACM
15 years 5 months ago
2005
ACM
The interconnection architecture of FPGAs such as switches dominates performance of FPGAs. Three-dimensional integration of FPGAs overcomes interconnect limitations by allowing in...
ISPD
2003
ACM
15 years 4 months ago
2003
ACM
Previous works on buffer planning are mainly based on fixed die placement. It is necessary to reduce the complexity of computing the feasible buffer insertion sites to integrate t...