—Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher ...
Multimedia systems play a central part in many human activities. Due to the significant advances in the VLSI technology, there is an increasing demand for portable multimedia appl...
Electrothermal couplings between supply voltage, operating frequency, power dissipation and die temperature have been shown to significantly impact the energy-delay-product (EDP) ...
Anirban Basu, Sheng-Chih Lin, Vineet Wason, Amit M...
Enterprises may have multiple database systems spread across the organization for redundancy or for serving different applications. In such systems, query workloads can be distrib...
With the continued scaling of CMOS technologies and reduced design margins, the reliability concerns induced by transient faults have become prominent. Moreover, the popular energ...