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ISCA
2010
IEEE
15 years 2 months ago
2010
IEEE
As CMOS scales beyond the 45nm technology node, leakage concerns are starting to limit microprocessor performance growth. To keep dynamic power constant across process generations...
TCAD
2002
14 years 9 months ago
2002
This paper introduces an accurate analysis of on-chip inductance effects for distributed interconnects that takes the effect of both the series resistance and the output parasitic ...
ISCAS
2008
IEEE
15 years 3 months ago
2008
IEEE
—In this paper, an energy-efficient and high performance ternary content addressable memory (TCAM) are presented. It employs the concept of “green” microarchitecture and circ...
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ARCS
2006
Springer
15 years 1 months ago
2006
Springer
State-of-the-art technologies in very large scale integration (VLSI) allow for the realization of gates with varying energy consumptions and hence delays (i.e., processing speeds) ...
DATE
2005
IEEE
15 years 3 months ago
2005
IEEE
Power dissipation during test is a major challenge in testing integrated circuits. Dynamic power has been the dominant part of power dissipation in CMOS circuits, however, in futu...