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DAC
2006
ACM
15 years 10 months ago
A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
Gian Luca Loi, Banit Agrawal, Navin Srivastava, Sh...
TVLSI
2010
14 years 4 months ago
A Novel Variation-Tolerant Keeper Architecture for High-Performance Low-Power Wide Fan-In Dynamic or Gates
Dynamic gates have been excellent choice in the design of high-performance modules in modern microprocessors. The only limitation of dynamic gates is their relatively low noise mar...
Hamed F. Dadgour, Kaustav Banerjee
ISQED
2006
IEEE
136views Hardware» more  ISQED 2006»
15 years 3 months ago
An Improved AMG-based Method for Fast Power Grid Analysis
The continuing VLSI technology scaling leads to increasingly significant power supply fluctuations, which need to be modeled accurately in circuit design and verification. Meanwhi...
Cheng Zhuo, Jiang Hu, Kangsheng Chen
HPCA
2009
IEEE
15 years 4 months ago
Soft error vulnerability aware process variation mitigation
As transistor process technology approaches the nanometer scale, process variation significantly affects the design and optimization of high performance microprocessors. Prior stu...
Xin Fu, Tao Li, José A. B. Fortes
ICCD
2005
IEEE
98views Hardware» more  ICCD 2005»
15 years 6 months ago
Reducing the Latency and Area Cost of Core Swapping through Shared Helper Engines
Technology scaling trends and the limitations of packaging and cooling have intensified the need for thermally efficient architectures and architecture-level temperature managem...
Anahita Shayesteh, Eren Kursun, Timothy Sherwood, ...