Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
Gian Luca Loi, Banit Agrawal, Navin Srivastava, Sh...
Dynamic gates have been excellent choice in the design of high-performance modules in modern microprocessors. The only limitation of dynamic gates is their relatively low noise mar...
The continuing VLSI technology scaling leads to increasingly significant power supply fluctuations, which need to be modeled accurately in circuit design and verification. Meanwhi...
As transistor process technology approaches the nanometer scale, process variation significantly affects the design and optimization of high performance microprocessors. Prior stu...
Technology scaling trends and the limitations of packaging and cooling have intensified the need for thermally efficient architectures and architecture-level temperature managem...
Anahita Shayesteh, Eren Kursun, Timothy Sherwood, ...