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DAC
2009
ACM
15 years 10 months ago
Exploring serial vertical interconnects for 3D ICs
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
Sudeep Pasricha
DAC
2007
ACM
15 years 10 months ago
A System For Coarse Grained Memory Protection In Tiny Embedded Processors
Many embedded systems contain resource constrained microcontrollers where applications, operating system components and device drivers reside within a single address space with no...
Ram Kumar, Akhilesh Singhania, Andrew Castner, Edd...
DAC
2007
ACM
15 years 10 months ago
A New Twisted Differential Line Structure in Global Bus Design
Twisted differential line structure can effectively reduce crosstalk noise on global bus, which foresees a wide applicability. However, measured performance based on fabricated ci...
Zhanyuan Jiang, Shiyan Hu, Weiping Shi
DAC
2004
ACM
15 years 10 months ago
Toward a methodology for manufacturability-driven design rule exploration
Resolution enhancement techniques (RET) such as optical proximity correction (OPC) and phase-shift mask (PSM) technology are deployed in modern processes to increase the fidelity ...
Luigi Capodieci, Puneet Gupta, Andrew B. Kahng, De...
DAC
2005
ACM
15 years 10 months ago
Multilevel full-chip routing for the X-based architecture
As technology advances into the nanometer territory, the interconnect delay has become a first-order effect on chip performance. To handle this effect, the X-architecture has been...
Tsung-Yi Ho, Chen-Feng Chang, Yao-Wen Chang, Sao-J...