12825 search results - page 2209 / 2565 » Improved PLSOM algorithm |
148
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ICCAD
2009
IEEE
15 years 2 months ago
2009
IEEE
Pre-bond testing of 3D stacked ICs involves testing individual dies before bonding. The overall yield of 3D ICs improves with prebond testability because designers can avoid stack...
135
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ICCAD
2009
IEEE
15 years 2 months ago
2009
IEEE
Traditional circuit design focuses on optimizing the static critical paths no matter how infrequently these paths are exercised dynamically. Circuit optimization is then tuned to ...
153
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ICCAD
2009
IEEE
15 years 2 months ago
2009
IEEE
Double patterning lithography (DPL) is a likely resolution enhancement technique for IC production in 32nm and below technology nodes. However, DPL gives rise to two independent, ...
180
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ICDE
2009
IEEE
15 years 2 months ago
2009
IEEE
There is a huge wealth of sequence data available, for example, customer purchase histories, program execution traces, DNA, and protein sequences. Analyzing this wealth of data to ...
140
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ICDM
2009
IEEE
15 years 2 months ago
2009
IEEE
Recently a number of modeling techniques have been developed for data mining and machine learning in relational and network domains where the instances are not independent and ide...