As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
Multiple dispatch – the selection of a function to be invoked based on the dynamic type of two or more arguments – is a solution to several classical problems in object-orient...
Peter Pirkelbauer, Yuriy Solodkyy, Bjarne Stroustr...
process: Designers must define higher abstraction levels that allow system modeling. They must use description languages that handle both hardware and software components to descri...
Technology scaling in integrated circuits has consistently provided dramatic performance improvements in modern microprocessors. However, increasing device counts and decreasing o...
One of the envisioned advantages of scalable video coding is its inherent suitability for achieving unequal error protection (UEP). UEP can be effectively used for graceful qualit...