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DAC
2010
ACM
13 years 10 months ago
TSV stress aware timing analysis with applications to 3D-IC layout optimization
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
Jae-Seok Yang, Krit Athikulwongse, Young-Joon Lee,...
GPCE
2007
Springer
14 years 12 days ago
Open multi-methods for c++
Multiple dispatch – the selection of a function to be invoked based on the dynamic type of two or more arguments – is a solution to several classical problems in object-orient...
Peter Pirkelbauer, Yuriy Solodkyy, Bjarne Stroustr...
DT
2006
180views more  DT 2006»
13 years 6 months ago
A SystemC Refinement Methodology for Embedded Software
process: Designers must define higher abstraction levels that allow system modeling. They must use description languages that handle both hardware and software components to descri...
Jérôme Chevalier, Maxime de Nanclas, ...
IEEEPACT
2008
IEEE
14 years 19 days ago
Skewed redundancy
Technology scaling in integrated circuits has consistently provided dramatic performance improvements in modern microprocessors. However, increasing device counts and decreasing o...
Gordon B. Bell, Mikko H. Lipasti
ICMCS
2010
IEEE
181views Multimedia» more  ICMCS 2010»
13 years 4 months ago
LDPC FEC code extension for unequal error protection in 2nd generation DVB systems
One of the envisioned advantages of scalable video coding is its inherent suitability for achieving unequal error protection (UEP). UEP can be effectively used for graceful qualit...
Lukasz Kondrad, Imed Bouazizi, Moncef Gabbouj