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100
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FGR
2008
IEEE
15 years 7 months ago
2008
IEEE
In recent years, 3D face recognition has obtained much attention. Using 2D face image as probe and 3D face data as gallery is an alternative method to deal with computation comple...
107
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ICCAD
2006
IEEE
15 years 9 months ago
2006
IEEE
The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...
120
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TCAD
2010
14 years 7 months ago
2010
Three-dimensional integrated circuits (3D-ICs) are a promising approach to address the integration challenges faced by current systems on chips (SoCs). Designing an efficient netwo...
118
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DATE
2009
IEEE
15 years 7 months ago
2009
IEEE
Three-dimensional integrated circuits are a promising approach to address the integration challenges faced by current Systems on Chips (SoCs). Designing an efficient Network on C...
119
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ICCV
2011
IEEE
14 years 25 days ago
2011
IEEE
We present a method for fusing two acquisition modes, 2D photographs and 3D LiDAR scans, for depth-layer decomposition of urban facades. The two modes have complementary character...